Launch of the CN176 Series, an interface connector for optical communication modules compatible with 1.6 Tbps Ethernet
We will expand our “CN176 Series” lineup and begin domestic sales of interface connectors for optical communication modules compatible with 1.6 Tbps Ethernet from December 2024.
With the spread of generative AI, the demand for connectors compatible with large-capacity, high-speed communications are rapidly increasing in the data center market. This product is an interface connector compatible with systems that make up AI/ML clusters*1 and is used for internal connections in AI data centers and other locations that require high bandwidth and low latency performance.
1.6Tbps Ethernet compatible
Interface connector for optical communication modules “CN176 series”
In the data center market, products compatible with 800 Gbps transmission begun to be introduced in 2023. In January 2024, we announced the single and stack types of the OSFP*2 series compatible with 800 Gbps transmission. The products announced this time will support 1.6 Tbps, enabling faster and larger-capacity data transmission.
We will continue to develop products in line with customer needs to respond to the market where the increase in transmission data capacity and the acceleration of faster transmission performance will continue.
*1 An AI/ML cluster refers to a collection of hardware and software for efficient research and development into artificial intelligence (AI) and machine learning (ML), or for efficient data processing.
*2 OSFP: OCTAL SMALL FORM FACTOR PLUGGABLE MODULE
Features
– Single type connector and mechanical unit compatible with 1.6Tbps (PAM4 224Gbps)/slot
– High signal quality is ensured by SMT (Surface Mount Technology) specifications that solder (mount) components directly onto the integrated circuit
– Designed with excellent heat dissipation, it can support 30W modules
– Compliant with industry standard (The OpenZR+ Multi-Source Agreement = MSA) that takes into account mounting to OSFP and interoperability
