Launch of the CN214 Series, an interface connector for optical communication modules compatible with 1.6 Tbps Ethernet
We have developed and will begin selling the new CN214 series, an interface connector for optical communication modules that supports 1.6 Tbps Ethernet.
With the spread of generative AI, the demand for connectors that can handle large-capacity, high-speed communications is rapidly increasing in the data center market. This series follows the CN176 series, an OSFP connector that supports 1.6 Tbps Ethernet, announced on December 2nd, and is an interface connector for optical communication modules that supports 1.6 Tbps Ethernet and conforms to the OSFP-XD*1 standard. In addition to use in conventional data centers, this series is an interface connector that is compatible with systems that make up AI/ML clusters*2 and is used for connection applications that require high bandwidth and low latency performance, such as AI data centers.
1.6Tbps Ethernet compatible
Interface connector for optical communication modules “CN214 series”
In the data center market, products compatible with 800Gbps began to be introduced in 2023. As we enter 2024, the demand for faster transmission performance and large-capacity data transmission is accelerating. In order to meet the increasing transmission capacity in the market, we will start selling OSFP-XD single connectors that can transmit 1.6Tbps with 112Gbps PAM4 signal transmission method.
We will continue to develop products in line with customer needs to respond to the market where the increase in transmission data capacity and the acceleration of faster transmission performance will continue.
*1 OSFP-XD: OCTAL SMALL FORM FACTOR PLUGGABLE eXtra-Dense
OSFP-XD is an interface standard for next-generation ultra-high-speed networks that achieves 1.6 Tbps transmission using PAM4 (Pulse Amplitude Modulation 4) 112G signaling with 16 electrical signal channels, twice as many as OSFP.
*2 An AI/ML cluster refers to a collection of hardware and software for efficient research and development into artificial intelligence (AI) and machine learning (ML), or for efficient data processing.
Features
– Single type connector and mechanical unit compatible with 1.6Tbps (PAM4 112Gbps x 16 ch)/slot
– Supports 92Ω impedance matching, making it compliant with both PCIe and Ethernet standards
– High signal quality is ensured by SMT (Surface Mount Technology) specifications that solder (mount) components directly onto the integrated circuit
– Designed with excellent heat dissipation, it can support 40W modules
– Compliant with industry standard (The OpenZR+ Multi-Source Agreement = MSA) that takes into account mounting to OSFP-XD and interoperability
