open top
Burn-in sockets for mass production enable automatic insertion and removal of semiconductors and are compatible with a wide range of package thicknesses.
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- Product name
- NP631 Series
- Features
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• Tweezer contact to reduce ball damage.
• Two-point contact structure for high contact reliability.
• Compatible with a wide range of package thicknesses.
• 0.65-mm pitch compatible.
- Category 1
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- Micro
- Logic
- Analog
- Category 2
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- BGA
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- Product name
- NP584 Series
- Features
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• Solutions for low-volume, high-variety production.
• Extensive lineup of contacts for different applications
• Pitch: 0.30 mm or more (staggered and irregular pitches available)
• Package size: 2.00 to 20.00 SQ
• Applicable packages: BGA/LGA/QFN/SON
- Category 1
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- Micro
- Logic
- Analog
- Category 2
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- BGA
- LGA
- QFN
- SON
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- Product name
- NP583 Series
- Features
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• 0.5-mm-pitch open top socket for QFNs.
• Compatible with center-ground pads.
• Compact size design.
- Category 1
-
- Micro
- Logic
- Analog
- Category 2
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- QFN
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- Product name
- NP566 Series
- Features
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• Tweezer contact to reduce ball damage.
• Two-point contact structure for high contact reliability.
• Compatible with a wide range of package thicknesses.
• 0.8-mm pitch compatible.
- Category 1
-
- Micro
- Logic
- Analog
- Category 2
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- BGA
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- Product name
- NP560 Series
- Features
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• Twin beam press contacts for reduced pad scratches.
• Compatible with a wide range of package thicknesses
- Category 1
-
- Micro
- Logic
- Analog
- Category 2
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- SON
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- Product name
- NP559 Series
- Features
-
• Tweezer contact to reduce ball damage.
• Two-point contact structure for high contact reliability.
• Compatible with a wide range of package thicknesses.
• 1.0-mm pitch compatible.
- Category 1
-
- Micro
- Logic
- Analog
- Category 2
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- BGA
