open top
Burn-in sockets for mass production enable automatic insertion and removal of semiconductors and are compatible with a wide range of package thicknesses.
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- Product name
- NP556 Series
- Features
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• U-shaped contact to prevent damage to the underside of the ball.
• Surface-mount-type contacts also available.
• Contacts for low-profile balls also available.
• 0.65-mm pitch.
- Category 1
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- Micro
- Logic
- Analog
- Category 2
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- BGA
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- Product name
- NP506 Series
- Features
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• 0.5-mm-pitch open top socket for QFNs.
• Compatible with center-ground pads.
• Compact size design.
- Category 1
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- Micro
- Logic
- Analog
- Category 2
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- QFN
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- Product name
- NP486 Series
- Features
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• Tweezer contact to reduce ball damage.
• Two-point contact structure for high contact reliability.
• Ball sticking prevention mechanism.
• Compatible with a wide range of package thicknesses.
• 1.0-mm pitch compatible.
- Category 1
-
- Micro
- Logic
- Analog
- Category 2
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- BGA
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- Product name
- NP483 Series
- Features
-
• Tweezer contact to reduce ball damage.
• Two-point contact structure for high contact reliability.
• Ball sticking prevention mechanism.
• Compatible with a wide range of package thicknesses.
• 1.0-mm pitch compatible.
- Category 1
-
- Micro
- Logic
- Analog
- Category 2
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- BGA
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- Product name
- NP481 Series
- Features
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• 0.4-mm-pitch bottom contact structure.
• Contacts for low-profile balls also available.
- Category 1
-
- Micro
- Logic
- Analog
- Category 2
-
- BGA
-
- Product name
- NP437 Series
- Features
-
• U-shaped contact to prevent damage to the underside of the ball.
• Surface-mount-type contacts also available.
• Contacts for low-profile balls also available.
• 0.4-mm pitch.
- Category 1
-
- Micro
- Logic
- Analog
- Category 2
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- BGA
