open top
Burn-in sockets for mass production enable automatic insertion and removal of semiconductors and are compatible with a wide range of package thicknesses.
-
- Product name
- NP404 Series
- Features
-
• 0.5-mm-pitch bottom contact structure.
- Category 1
-
- Micro
- Logic
- Analog
- Category 2
-
- BGA
- LGA
-
- Product name
- NP383 Series
- Features
-
• Tweezer contact to reduce ball damage.
• Two-point contact structure for high contact reliability.
• Ball sticking prevention mechanism.
• Compatible with a wide range of package thicknesses.
• 0.5-mm pitch compatible.
- Category 1
-
- Memory
- Micro
- Logic
- Analog
- Category 2
-
- BGA
-
- Product name
- NP378 Series
- Features
-
• Tweezer contact to reduce ball damage.
• Two-point contact structure for high contact reliability.
• Ball sticking prevention mechanism.
• Compatible with a wide range of package thicknesses.
• 0.65-mm pitch compatible.
- Category 1
-
- Micro
- Logic
- Analog
- Category 2
-
- BGA
-
- Product name
- NP352 Series
- Features
-
• Tweezer contact to reduce ball damage.
• Two-point contact structure for high contact reliability.
• Compatible with a wide range of package thicknesses.
- Category 1
-
- Micro
- Logic
- Analog
- Category 2
-
- BGA
-
- Product name
- NP351 Series
- Features
-
• Tweezer contact to reduce ball damage.
• Two-point contact structure for high contact reliability.
• Ball sticking prevention mechanism.
• Compatible with a wide range of package thicknesses.
- Category 1
-
- Memory
- Micro
- Logic
- Analog
- Category 2
-
- BGA
-
- Product name
- NP276 Series
- Features
-
• Tweezer contact to reduce ball damage.
• Two-point contact structure for high contact reliability.
• Compatible with a wide range of package thicknesses.
- Category 1
-
- Micro
- Logic
- Analog
- Category 2
-
- BGA
