open top
Burn-in sockets for mass production enable automatic insertion and removal of semiconductors and are compatible with a wide range of package thicknesses.
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- Product name
- IC572 Series
- Features
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• Open-top socket for QFPs with 0.5-mm pitch.
• Two-point contact structure for high contact reliability.
- Category 1
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- Micro
- Logic
- Analog
- Category 2
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- QFP
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- Product name
- IC398 Series
- Features
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• U-shaped contact to prevent damage to the underside of the ball.
• Surface-mount-type contacts also available.
• Contacts for low-profile balls also available.
- Category 1
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- Micro
- Logic
- Analog
- Category 2
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- BGA
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- Product name
- IC369 Series
- Features
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• Open-top socket for SOPs.
• Two-point contact structure for high contact reliability.
- Category 1
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- Micro
- Logic
- Analog
- Category 2
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- SOP
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- Product name
- IC357 Series
- Features
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• Open-top socket for QFPs.
• Two-point contact structure for high contact reliability.
- Category 1
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- Micro
- Logic
- Analog
- Category 2
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- QFP
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- Product name
- IC234 Series
- Features
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• Open-top socket for QFPs.
• Contact design to make contact with lead shoulders.
• No damage to IC lead solder surface and no foreign matter adhesion.
• Can be used for both long and short IC leads.
- Category 1
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- Micro
- Logic
- Analog
- Category 2
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- QFP
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- Product name
- IC201 Series
- Features
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• Open-top sockets for QFPs.
• Contact manipulation by lever ensures low operation force and high durability.
• Unique contact design provides outstanding contact reliability.
- Category 1
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- Micro
- Logic
- Analog
- Category 2
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- QFP
