open top
Burn-in sockets for mass production enable automatic insertion and removal of semiconductors and are compatible with a wide range of package thicknesses.
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- Product name
- IC189 Series
- Features
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• Open-top socket for bi-directional packages, such as SOPs, SSOPs, TSOPs, etc.
• Contact manipulation by lever ensures low operation force and high durability.
- Category 1
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- Memory
- Category 2
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- SOP
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- Product name
- IC120 Series
- Features
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• Socket for QFJ with 1.27-mm pitch.
• High reliability with a two-point contact structure.
• One-touch insertion and removal of ICs.
• Two types of IC mounting, front and back.
- Category 1
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- Micro
- Logic
- Analog
- Power device
- Category 2
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- QFJ
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- Product name
- NP364 Series
- Features
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• Bottom contact method.
• Contacts for low-profile balls also available.
- Category 1
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- Memory
- Category 2
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- BGA
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- Product name
- NP352 Series
- Features
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• Tweezer contact to reduce ball damage.
• Two-point contact structure for high contact reliability.
• Compatible with a wide range of package thicknesses.
- Category 1
-
- Memory
- Category 2
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- BGA
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- Product name
- IC354 Series
- Features
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• Open-top socket for TSOPIs.
• Compact-size design.
- Category 1
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- Memory
- Category 2
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- SOP
