others
Single-in-line-package (SIP), dual in-line package (DIP), and zig-zag in-line package (ZIP) sockets are lined up. Highly reliable double-sided movable two-point contacts are used.
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- Product name
- SMT Series
- Features
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• Solutions for low-volume, high-variety production.
• Extensive lineup of contacts for different applications.
- Category 1
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- Logic
- Analog
- Power device
- Category 2
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- LCC
- PLCC
- QFP
- QFN
- SOP
- QFJ
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- Product name
- NP89 Series
- Features
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• The self-cleaning mechanism allows the contacts to slide over the IC leads when the handle is operated, wiping off any dust or debris that may adhere to the IC leads, ensuring reliable contact, and preventing problems such as short circuits.
• High reliability with a three-point contact structure.
• Low-cost product with partial gold plating for cost reduction.
- Category 1
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- Micro
- Logic
- Module
- Category 2
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- PGA
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- Product name
- IC91 Series
- Features
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• Sockets for DIPs.
• Double-sided, movable, two-point contact structure for high reliability.
• Low-cost product with partial gold plating.
- Category 1
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- Logic
- Analog
- Power device
- Category 2
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- DIP
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- Product name
- IC76 Series
- Features
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• Sockets for SIPs.
• Double-sided, movable, two-point contact structure for high reliability.
• Low-cost product with partial gold plating.
- Category 1
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- Logic
- Analog
- Power device
- Category 2
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- DIP
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- Product name
- IC70 Series
- Features
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• Sockets for SIPs.
• Double-sided, movable, two-point contact structure for high reliability.
• Low-cost product with partial gold plating.
- Category 1
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- Logic
- Analog
- Power device
- Category 2
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- SIP
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- Product name
- IC59 Series
- Features
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• Socket for SDIPs.
• Double-sided, movable, two-point contact structure for high reliability.
• The same socket can be used as an adapter socket.
- Category 1
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- Logic
- Analog
- Power device
- Category 2
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- DIP
