others
Single-in-line-package (SIP), dual in-line package (DIP), and zig-zag in-line package (ZIP) sockets are lined up. Highly reliable double-sided movable two-point contacts are used.
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- Product name
- IC46 Series
- Features
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• Sockets for SIPs.
• Short IC leads can be used because the contact position is high.
- Category 1
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- Logic
- Analog
- Power device
- Category 2
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- SIP
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- Product name
- IC37 Series
- Features
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• Sockets for DIPs.
• Double-sided, movable, two-point contact structure for high reliability.
- Category 1
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- Micro
- Logic
- Analog
- Category 2
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- DIP
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- Product name
- IC118 Series
- Features
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• 1.27-mm pitch socket for ZIPs.
• Double-sided movable two-point contact structure for high reliability.
• The contact surface is maximized for stable contact reliability and easy IC insertion/removal on automatic machines.
- Category 1
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- Logic
- Analog
- Power device
- Category 2
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- ZIP
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- Product name
- IC114 Series
- Features
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• Highly reliable contacts with two movable points on both sides.
• The function of a parent-child socket is added by simply replacing the child socket, eliminating the need to remove and install the wiring.
• Two types of terminals for solder dip and lead wire connection. 2.54-mm pitch 54-mm pitch
- Category 1
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- Logic
- Analog
- Power device
- Category 2
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- DIP
