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- YFLEX® (flexible wiring board)
- High-flexibility FPC
High-flexibility FPC
- Features
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Capable of up to 10 million bends (R = 5 mm).
- Specifications (general performance)
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• Flexing characteristics of more than 10 million times at R-5.0 mm.
• Supports high-speed transmission in Gpbs or higher ranges with low loss.
• Flexible and has high reliability.
- Specifications (electrical performance)
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Item Conditions Test result Resistance test per bump Normal temperature/Normal humidity 6 mΩ max. Temperature and humidity cycle test -55°C to 125°C, 1000 cycles Resistance change rate within 10% High-temperature retention test 85℃, 1,000 h Resistance change rate within 10% Low-temperature retention test -40℃, 1,000 h Resistance change rate within 10% High-temperature constant-humidity test 85℃, 90% (RH), 1,000 h Resistance change rate within 10% Ion migration test 40℃, 90% (RH), 60 VDC, 1,000 h No abnormality Copper foil pull-off strength test 90 peels (copper thickness: 35 μm) 0.8 kN/m min. Soldering heat resistance test 260℃, 20 S No abnormality Inductance (1 GHz) Bridge method 2.8 Dielectric loss tangent (1 GHz) Bridge method 0.0025 Water absorption rate 23℃, 24 h 0.04% max. Thermal expansion coefficient Thermomechanical analysis (TMA) Vertical direction: 17 ppm Lateral direction: 17 ppm R = 5.0 mm; More than 10 million times
Evaluation conditions: Clearance: 10 mm (R=5); Stroke: 80±1 mm; Speed: 35 times/min.
- Download
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High-flexibility FPC You can download the product diagram and catalog data.
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image
product name
document
explanation
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High-flexibility FPC
・Catalog
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