High heat resistant FPC

Features

Even after use in high temperature process at 150°C for 3,000 hours, there is no problem with electrical properties. It can be used such as in-vehicle equipment, semiconductor manufacturing, and inspection equipment.

*Evaluation item: High temperature exposure at 150℃×3,000h

*Judgment criteria: Continuity resistance change rate within ±10% and insulation resistance of 500 MΩ or more

Configurations can be single-layer or double-layer, and the insulation substrate base can be selected from liquid crystal polymer (LCP) or polyimide (PI).

Type: All 3 types

・YFA series (LCP base material, single-layer)

・YFB series (LCP base material, double-layer)

・YFH series (PI base material, single-layer / double-layer)

Due to the reinforced GND design, it can be used not only for high heat resistant FPC applications but also for noise resistant FPC applications.

Specifications (general performance)

Specifications (electrical performance)

Items	Conditions	Requirements	YFB （LCP double-layer　board） Cu18μm、 L/S＝60/60μ	YFH （PI single-layer board） Cu35μm、 L/S＝100/100μ
Surface layer withstand voltage	AC500V 1 minute	Discharge phenomena and traces not occur	〇	〇
Temperature and humidity cycle	– 10℃ /＋ 65℃ 80～98%RH 10cyc	Continuity resistance change rate within ±10% and insulation resistance of 500 MΩ or more	〇	〇
Thermal shock	– 55℃ to ＋125℃ （30 minutes each） / 1000cyc	Continuity resistance change rate within ±10% and insulation resistance of 500 MΩ or more	〇	〇
High temperature exposure	＋150℃ / 3000h	Continuity resistance change rate within ±10% and insulation resistance of 500 MΩ or more	〇	〇
Low temperature exposure	– 65℃ / 1000h	Continuity resistance change rate within ±10% and insulation resistance of 500 MΩ or more	〇	〇
High temperature and high humidity	＋85℃ / 85%RH / 1000h	Continuity resistance change rate within ±10% and insulation resistance of 500 MΩ or more	〇	〇